PRO
Thanjavur, India
MLO SUBSTRATE DESIGNER
Local Time - 03:49 PM
About Me
Highly skilled IC Package Substrate Design Engineer with 3+ years of extensive experience in designing high performance multi layer organic substrates, flip chip BGA, ceramic substrates, and coreless substrates. Adept at leading the design process from concept to completion, including schematic creation, library creation, stack up design, component placement, constraints setup, layout design, and Gerber generation. Proven expertise in optimizing signal and power integrity SI/PI for high speed interfaces such as PCIe, DDR, USB, WLAN, MIPI, and RF signals. Proficient in utilizing industry leading tools such as Cadence Allegro, and OrCAD, with a strong focus on achieving customer specifications while ensuring high quality and performance standards.
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